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Research Reports

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Future Market Insights has presented a detailed analysis and revised forecast analysis in its new report titled, “Semiconductor Assembly and Testing Services (SATS) Market: Global Industry Analysis (2012-2016) and Opportunity Assessment (2017-2027)“. The global semiconductor assembly and testing services (SATS) market was valued at US$ 27,700 Mn in 2016, and is expected to register a CAGR of 4.7% from 2017 to 2027. Growing demand of consumer electronics, increasing integration of electronics and connectivity in automotive are major factors driving growth of the global semiconductor assembly and testing services (SATS) market.

Semiconductor industry is highly volatile in nature. Major market participants in this industry are fabless companies that focus on leveraging their resources in designing and utilizing their expertise in enhancing performance of the chipsets or ICs. Therefore, most of the semiconductor assembly, testing, and packaging related services are outsourced by fabless companies to third party providers known as ‘Outsourced Semiconductor Assembly and Test Service Providers’. Moreover, with the shift of semiconductor process technology to the larger wafers and smaller feature sizes, the cost of building a state-of-the-art wafer fabrication factory has increased considerably. Semiconductor assembly and testing services are offered in various end user industries. One of the major applications of semiconductor assembly and testing services is for communication.

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semiconductor assembly and testing services sats market share by region

Key Takeaways of Semiconductor Assembly and Testing Services Market Study

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Competitive Assessment

Some of the top companies identified across the Semiconductor Assembly and Testing Services (SATS) value chain are ASE Group, Amkor Technology, JCET, Powertech Technology Inc., SPIL, UTAC, ChipMOS TECHNOLOGIES INC., Tongfu Microelectronics Co. Ltd., Tianshui Huatian Technology Co., Ltd, King Yuan ELECTRONICS Co. Ltd. And others.

Semiconductor Assembly and Testing Services Market: Segmentation

By Services

  • Assembly & Packaging Services
    • Copper Wire & Gold Wire Bonding
    • Flip Chip
    • Wafer Level Packaging
    • TSV
    • Others
  • Testing Services


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Frequently Asked Questions about Semiconductor Assembly and Testing Services Market

The post Semiconductor Assembly And Testing Services Market Top Scenario, SWOT Analysis, Business Overview, Forecast 2027 appeared first on Industry News Analsis.

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