Advanced Packaging Market to Exceed US$ 61.3 Billion by 2033 as Sales of Embedded Die Packaging Solutions Burgeons Globally
The USA advanced packaging market is expected to reach a valuation of US$ 9.9 billion by 2033. It is anticipated to exhibit 6.6% CAGR from 2023 to 2033. Key players in the USA are setting up fabrication facilities in the country for research and development activities. The United Kingdom advanced packaging market is expected to be valued at US$ 1.7 billion by 2033. Between 2023 and 2033, the country is set to showcase a CAGR of 5.6%, says Future Market Insights. It is likely to create an incremental opportunity of about US$ 712.8 million throughout the assessment period.
NEWARK, Del: The global advanced packaging market is anticipated to be valued at US$ 30.5 billion in 2023 and reach US$ 61.3 billion by 2033. It is likely to exhibit a considerable CAGR of 7.2% between 2023 and 2033.
Advanced packaging technology has transformed in order to lower associated costs, increase integrated circuit throughput, and enhance overall performance. Due to increasing use of semiconductor integrated circuits in automobiles, there has been a considerable surge in terms of demand for sophisticated packaging in the last five years.
Massive system-on-chip solutions would support a high density as packing technology advances. The semiconductor industry has created a new set of solutions known as advanced packaging as a result of increasing focus on wafer-level packages and heterogeneous integrations.
Advanced semiconductor packaging is rapidly gaining ground on conventional semiconductor packaging all around the world. Electronics device miniaturization is boosting global sales of sophisticated packaging.
Micro-electromechanical systems (MEMS) are expected to be widely used, which will further drive demand for embedded die packaging solutions. The technology is not new, but owing to its high cost and low yield, it has been tailored for certain uses.
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Key Takeaways from the Advanced Packaging Market Study
- In terms of end user, the consumer electronics segment is set to dominate by exhibiting around 7.0% CAGR from 2023 to 2033.
- The USA advanced packaging industry is projected to create an absolute dollar opportunity of US$ 4.7 billion through 2033.
- South Korea advanced packaging market is expected to be worth US$ 3.7 billion by 2033.
- China advanced packaging market is likely to be worth US$ 15.5 billion by 2033.
- The United Kingdom advanced packaging market is estimated to showcase a CAGR of 5.6% between 2023 and 2033.
“Electronic device performance has constantly been sought for a variety of applications, including industrial, automotive, consumer, and mobile ones. Key companies are projected to develop all integrated circuit packaging, including fan-out wafer-level packages (FOWLP), with the help of special electronic solutions such as insulators and conductors,” says a lead analyst at Future Market Insights.
Competitive Landscape: Advanced Packaging Market
Due to the demand for cutting-edge technology and quick-responding devices, renowned companies are set to dominate the global advanced packaging market. These businesses continue to have a competitive advantage in the market owing to the elevated need for distinctive solutions for various applications. The industry is further anticipated to gain traction from continuous developments in technology such as wireless communications, tablets, and smartphones.
Get More Valuable Insights into Advanced Packaging Market
Future Market Insights, in its new offering, provides an unbiased analysis of the advanced packaging market presenting historical demand data (2018 to 2022) and forecast statistics for the period from 2023 to 2033. The study incorporates compelling insights on the advanced packaging market based on type (flip chip scale package, flip chip ball grid array, wafer level chip scale package, 5D/3D, fan out wafer-level packaging), end user (consumer electronics, automotive, industrial, healthcare, aerospace & defense), and region.
For additional insights on how the growth of the advanced packaging market will shape up over the next decade, write to firstname.lastname@example.org
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Advanced Packaging Market Outlook by Category
- Flip Chip Scale Package
- Flip Chip Ball Grid Array
- Wafer Level Chip Scale Packaging
- Fan Out Wafer-level Packaging
By End User:
- Consumer Electronics
- Aerospace and Defense
- North America
- Asia Pacific
- Latin America
- Middle East & Africa
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Table of Content
- Executive Summary | Advanced Packaging Market
1.1. Global Market Outlook
1.2. Demand-side Trends
1.3. Supply-side Trends
1.4. Technology Roadmap Analysis
1.5. Analysis and Recommendations
- Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
- Market Background
3.1. Market Dynamics
3.2. Scenario Forecast
3.2.1. Demand in Optimistic Scenario
3.2.2. Demand in Likely Scenario
3.2.3. Demand in Conservative Scenario
3.3. Opportunity Map Analysis
3.4. Investment Feasibility Matrix
3.5. PESTLE and Porter’s Analysis
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Flexible Packaging Paper Market : The flexible packaging paper market is on track to grow at an estimated CAGR of 4% during 2022-2032.
Biodegradable Packaging Market : According to Future Market Insights research, during the projected period, the global biodegradable packaging market is set to enjoy a valuation of US$ 448.2 Bn in 2022, and further expand at a CAGR of 6.1% during 2022-2032. The sales of biodegradable packaging are estimated to propel with the top 3 countries projected to hold approximately 25-30% of the market by the end of 2022.
Protective Packaging Market : The global protective packaging market is set to gain a valuation of US$ 28.3 billion in 2023. Between 2023 and 2033, it is likely to extend at a steady CAGR of 5.0% and register a valuation of US$ 46.1 billion in 2033. Protective packaging sales are anticipated to bolster with the top 5 countries projected to hold approximately 45 to 55% of the market in 2023.
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